发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH TERMINAL LOCKS AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a cornered dimple formed therein as a simple concave polygon; mounting an integrated circuit above and coupled to the terminal; and forming an encapsulation encapsulating the integrated circuit and portions of the terminal.
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申请公布号 |
US2012205811(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213366768 |
申请日期 |
2012.02.06 |
申请人 |
DO BYUNG TAI;CHUA LINDA PEI EE;TRASPORTO ARNEL SENOSA |
发明人 |
DO BYUNG TAI;CHUA LINDA PEI EE;TRASPORTO ARNEL SENOSA |
分类号 |
H01L23/48;H01L21/56 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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