发明名称 |
CONNECTING STRUCTURE |
摘要 |
In a connecting structure which is used in situations of electronic component mounting and via hole connection, where a first article being connected and a second article being connected are connected using solder, the present invention increases the joining reliability after thermal shock. When the cross-section of a connection part (4) is analyzed by WDX, a region (9) where at least Cu-Sn based, M-Sn based (M being Ni and/or Mn), and Cu-M-Sn based intermetallic compounds are present is formed in the cross-section of that connection part (4). In addition, when the cross-section of the connection part (4) is segmented uniformly so that there are 10 units per row and column for a total of 100 units, the proportion of the number of units where at least two or more intermetallic compounds of different constituent elements are present is set to 70% or greater of the total number of units excluding those where only the Sn metal component is present in a unit. |
申请公布号 |
WO2012108395(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
WO2012JP52653 |
申请日期 |
2012.02.07 |
申请人 |
MURATA MANUFACTURING CO., LTD.;NAKANO, KOSUKE;TAKAOKA, HIDEKIYO |
发明人 |
NAKANO, KOSUKE;TAKAOKA, HIDEKIYO |
分类号 |
H01R4/02;B23K35/26;B23K35/30;B23K35/363;C22C9/02;C22C9/05;C22C9/06;C22C13/00 |
主分类号 |
H01R4/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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