| 摘要 |
<p>A resin multilayer substrate (1) is provided with: a plurality of resin layers (2), which respectively have main surfaces (2a), and which are laminated to each other; and metal foils (4), each of which is disposed to cover a part of each of the main surfaces (2a). Via conductive bodies (3) are formed to penetrate the resin layers (2) in the thickness direction, respectively. Each of the via conductive bodies (3) and each of the metal foils (4) are electrically connected in one via conductive body exposed region (5), i.e., a region where each of the via conductive bodies (3) is exposed from each of the main surfaces (2a), by having merely a part of the via conductive body exposed region (5) covered with each of the metal foils (4). The via conductive bodies (3) are electrically connected to a via conductive body (10), i.e., other conductive body adjacent to the via conductive bodies in the thickness direction, via at least a region not covered with one of the metal foils (4) in the via conductive body exposed region (5).</p> |
