| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress deteriorated reliability of a semiconductor device transmitting a plurality of differential signals. <P>SOLUTION: An area-array-type semiconductor 10 includes a plurality of lands (external terminals) LDp including a plurality of lands (first external terminals) LDp1 for transmitting the plurality of differential signals, disposed on the rear surface 12b of a wiring board 12 with a matrix-shaped arrangement pattern. In the semiconductor 10, a portion of the plurality of lands LDp1 is disposed on the outermost circumference of the arrangement pattern. On the rear surface 12b of the wiring board 12, another portion of the plurality of lands LDp1 is disposed inner than the outermost circumference of the arrangement pattern and on the neighboring column to the outermost circumference. In a second region R2 between the land LDp1 disposed on the neighboring column to the outermost circumference and the side face of the wiring board 12, disposition intervals of the plurality of lands LDp are broader than in a first region R1 of the outermost circumference. <P>COPYRIGHT: (C)2012,JPO&INPIT |
