发明名称 LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To prevent a liquid chemical from infiltrating into a line for gas discharge, in a liquid processing apparatus including a nozzle for discharging the liquid chemical to a lower surface of a substrate and a nozzle for discharging two-fluid for which a process liquid and a gas are mixed to the lower surface of the substrate. <P>SOLUTION: An apparatus includes a nozzle 60 provided with a first discharge port 61 for discharging a processing fluid containing the liquid chemical to the lower surface of the substrate and a second discharge port 62 for discharging the two-fluid for which the process liquid and the gas are mixed to the lower surface of the substrate. At the part of the second discharge port of the nozzle, a process liquid discharge path 67b for guiding the process liquid to the second discharge port and a gas discharge path 68b for guiding the gas to the second discharge port are merged. When executing two-fluid spray processing, the gas is made to flow to the second discharge port at a first flow rate required for the execution of the two-fluid spray processing. When not executing the two-fluid spray processing, the gas is made to flow to the second discharge port at a second flow rate lower than the first flow rate at least while a first liquid chemical is being discharged from the first discharge port. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012156268(A) 申请公布日期 2012.08.16
申请号 JP20110013463 申请日期 2011.01.25
申请人 TOKYO ELECTRON LTD 发明人 TOJIMA JIRO;ITO KIKO
分类号 H01L21/304;H01L21/027;H01L21/306 主分类号 H01L21/304
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