Lighting device i.e. LED module, has encapsulation chamber encapsulating semiconductor light source, and film-shaped optic element applied on free-surface of encapsulation chamber that consists of casting material such as silicone

摘要

The device (100) has an encapsulation chamber (104) encapsulating a semiconductor light source e.g. LED (103) such as mint green LED and red LED. A film-shaped optic element (105) i.e. diffuser element, is applied on a free-surface of the encapsulation chamber that consists of casting material i.e. silicone. The optic element exhibits a structured free-surface (107) that consists of a rough surface. The optical element is made from plastic such as acrylonitrile butadiene styrene (ABS), polycarbonate (PC), silicone, epoxy and/or poly-methyl methacrylate (PMMA).