| 摘要 |
A mold-tool system (100), comprising: a manifold assembly (102); a plate assembly (104) defining a manifold-receiving space (105) receiving the manifold assembly (102); a nozzle assembly (106); a nozzle-locating assembly (108) positionally locating the nozzle assembly (106) relative to the manifold assembly (102) and to the plate assembly (104); and a heat-transfer obstruction (110) being positioned between the plate assembly (104) and the nozzle-locating assembly (108), the heat-transfer obstruction (110) being configured to obstruct transfer of heat from the plate assembly (104) toward the nozzle-locating assembly (108).
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