| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an adhesive composition and adhesive sheet, which have sufficient adhesion strength between a base material and an adhesive layer, have excellent pickup strength, and can achieve high reliability of a semiconductor package. <P>SOLUTION: The adhesive composition contains an acrylic polymer (A), an epoxy thermosetting compound (B), and a thermosetting agent (C). 5 to 15 pts.mass of acrylic polymer (A) is contained in 100 pts.mass of the adhesive composition. Moreover, the acrylic polymer (A) has a glass transition temperature of -30°C or lower. <P>COPYRIGHT: (C)2012,JPO&INPIT |
