| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an epoxy resin composition which is a material usable for miniaturized and thinned printed circuit boards, is excellent in low thermal linear expansion and plating adhesion, adapts to fine wiring and has excellent electrical reliability, and to provide prepregs, laminates, printed circuit boards and semiconductor devices using the epoxy resin composition and excellent in electrical reliability. <P>SOLUTION: There is provided an epoxy resin composition comprising (A) an epoxy resin, (B) an inorganic filler and (C) a siloxane compound having a triazinethiol group. <P>COPYRIGHT: (C)2012,JPO&INPIT |
