发明名称 HALOGEN-FREE EPOXY RESIN COMPOSITION, PREPREG AND PRINTED CIRCUIT BOARD MADE USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a halogen-free epoxy resin composition obtainable of a prepreg with excellent processability. <P>SOLUTION: The halogen-free epoxy resin composition includes: a component (A) at least one halogen-free epoxy resin; a component (B) a curing agent; a component (C) a flame retardant curing agent; a component (D) a curing accelerator; a component (E) a filler made of a composite inorganic powder including at least silica, an aluminum compound, sodium oxide, potassium oxide, and magnesium oxide; and a component (F) a surfactant as a silane coupling agent having methacryloyloxy and methoxysilane. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153829(A) 申请公布日期 2012.08.16
申请号 JP20110015552 申请日期 2011.01.27
申请人 ITEQ CORP 发明人 LIU LAI TU;LIN WEI HSUAN
分类号 C08G59/20;C08J5/24;C08K3/00;C08K5/5419;C08L63/00;H05K1/03 主分类号 C08G59/20
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