| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wiring board which meets a demand for the improvement of the electrical reliability, a mounting structure of the wiring board, and a manufacturing method of the wiring board. <P>SOLUTION: A wiring board 3 according to one embodiment of this invention includes: a substrate 7 including a base material 11 and a resin part 10; a first conductor layer 13a partially formed on one main surface of the substrate 7; a second conductor layer 13b partially formed on the other main surface of the substrate 7; and through hole conductors 8 penetrating the substrate 7 and connecting with the first conductor layer 13a and the second conductor layer 13b. Each through hole conductor 8 becomes narrow from the second conductor layer 13b to the first conductor layer 13a, and the second conductor layer 13b is thicker than the first conductor layer 13a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
