FORMATION OF SELF-ALIGNED VIA HOLES IN POLYMER THIN FILMS

摘要

PROBLEM TO BE SOLVED: To realize formation of vias in an organic field effect transistor through low-cost and efficient processes.

SOLUTION: In forming vias 113 in a dielectric layer 106, posts based on a patterned conductive material are printed at each via location, the unpatterned dielectric layer 106 is deposited, and a second patterned conductive layer is deposited. The vias 113 are formed by flash annealing of the posts after the dielectric layer 106 is deposited and before the second conductive layer is deposited.

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