| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device of high reliability, being excellent in heat radiation characteristic, which is hard to cause such problem as a jointing strength of a mounted electronic element degrades because of heating at operation, or, an electric characteristic fluctuates. <P>SOLUTION: A substrate 1 has a structure in which a first substrate layer 11, an insulator layer 12, and a second substrate layer 13 are stacked in this order. A recess 131 for fitting an electronic element is provided in the plane of the surface of the second substrate layer 13. A through electrode 2 penetrates the first substrate layer 11 and the insulating layer 12, with an end part exposed from the bottom surface of the recess 131, each of post-like heatsinks 3 is packed in a vertical hole 113 provided in the thickness direction of the first substrate layer 11. The vertical hole 131 is so provided as to penetrate the first substrate layer 11 and stop at the border between the first substrate layer 11 and the insulator layer 12. They are distributed around the recess 131 at a predetermined occupancy rate when the substrate 1 is viewed from above. <P>COPYRIGHT: (C)2012,JPO&INPIT |
