| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an apparatus for treating a substrate, which can immerse the whole part of a workpiece into a treatment liquid by the rotation of a holder and evenly treat the whole region of the workpiece to enable the whole region of the workpiece to be used as a product. <P>SOLUTION: The apparatus for treating a substrate includes: a treatment vessel 1 for accommodating the treatment liquid 4 for treating a wafer 5; the holder 30 for holding the wafer 5 without gripping the wafer in a position on the circumference of a circle having a radius larger than a distance between the center and the outermost position of the wafer 5, to immerse the wafer 5 into the treatment liquid 4; and a rotary device 101 for rotating the holder 30 by setting the center of the circumference as a rotary center thereof. <P>COPYRIGHT: (C)2012,JPO&INPIT |
