发明名称 METHOD FOR SCRIBING BRITTLE MATERIAL SUBSTRATE
摘要 <P>PROBLEM TO BE SOLVED: To provide a scribing method formable of efficiently and surely a scribe line onto a brittle material substrate such as a glass substrate having a resin layer formed thereon. <P>SOLUTION: A grooved cutter wheel 10 is used, which has two-stage blade surfaces comprising a pair of right and left first blade surfaces 12 on which a ridge line forming a first ridge line angle &theta;<SB POS="POST">1</SB>is formed along a circular peripheral edge and a pair of right and left second blade surfaces 13 successive to the root side of the first blade surfaces 12, and which has the two-stage blade surfaces in which the first blade surfaces 12 are formed at an angle suitable for processing a brittle material substrate and the second blade surfaces 13 are formed at an angle suitable for cutting a resin layer. The cutter wheel 10 is made pressure-contact with the upper surface of the resin layer 3 and simultaneously rolled, to thereby cut the resin layer 3 by the second blade surfaces 13, and to form a scribe line by allowing a blade edge ridge line of the first blade surfaces 12 to bite the substrate. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153585(A) 申请公布日期 2012.08.16
申请号 JP20110015447 申请日期 2011.01.27
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 KAWABATA TAKASHI
分类号 C03B33/10;B28D1/24;B28D5/00 主分类号 C03B33/10
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