发明名称 |
Packaged Semiconductor Device with Encapsulant Embedding Semiconductor Chip that Includes Contact Pads |
摘要 |
A method of manufacturing a semiconductor package includes embedding a semiconductor chip in an encapsulant. First contact pads are formed on a first main face of the semiconductor package and second contact pads are formed on a second main face of the semiconductor package opposite the first main face. A diameter d in micrometers of an exposed contact pad area of the second contact pads satisfies d≧(8/25)x+142 μm, where x is a pitch of the second contact pads in micrometers.
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申请公布号 |
US2012208319(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213453787 |
申请日期 |
2012.04.23 |
申请人 |
MEYER THORSTEN;LEUSCHNER RAINER;OFNER GERALD;HESS REINHARD;SEZI RECAI;INFINEON TECHNOLOGIES AG |
发明人 |
MEYER THORSTEN;LEUSCHNER RAINER;OFNER GERALD;HESS REINHARD;SEZI RECAI |
分类号 |
H01L21/77;B23K31/02;H01L21/78 |
主分类号 |
H01L21/77 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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