发明名称 |
HOLE FORMATION METHOD, MULTILAYER WIRING, SEMICONDUCTOR DEVICE, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM CONTAINING VIA HOLE FORMED BY THE HOLE FORMATION METHOD |
摘要 |
A hole formation method including applying a pillar-forming liquid to a base material, to thereby form a pillar; applying an insulating film-forming material to the base material on which the pillar has been formed, to thereby form an insulating film; removing the pillar to form an opening in the insulating film; and heat treating the insulating film in which the opening has been formed.
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申请公布号 |
US2012206068(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213372874 |
申请日期 |
2012.02.14 |
申请人 |
SONE YUJI;UEDA NAOYUKI;NAKAMURA YUKI;ABE YUKIKO;MURATA KAZUHIRO;MASUDA KAZUYUKI;SIJTECHNOLOGY, INC.;RICOH COMPANY, LTD. |
发明人 |
SONE YUJI;UEDA NAOYUKI;NAKAMURA YUKI;ABE YUKIKO;MURATA KAZUHIRO;MASUDA KAZUYUKI |
分类号 |
H05B37/02;B05D1/04;B05D3/02;B05D5/00;H05K1/11 |
主分类号 |
H05B37/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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