发明名称 HOLE FORMATION METHOD, MULTILAYER WIRING, SEMICONDUCTOR DEVICE, DISPLAY ELEMENT, IMAGE DISPLAY DEVICE, AND SYSTEM CONTAINING VIA HOLE FORMED BY THE HOLE FORMATION METHOD
摘要 A hole formation method including applying a pillar-forming liquid to a base material, to thereby form a pillar; applying an insulating film-forming material to the base material on which the pillar has been formed, to thereby form an insulating film; removing the pillar to form an opening in the insulating film; and heat treating the insulating film in which the opening has been formed.
申请公布号 US2012206068(A1) 申请公布日期 2012.08.16
申请号 US201213372874 申请日期 2012.02.14
申请人 SONE YUJI;UEDA NAOYUKI;NAKAMURA YUKI;ABE YUKIKO;MURATA KAZUHIRO;MASUDA KAZUYUKI;SIJTECHNOLOGY, INC.;RICOH COMPANY, LTD. 发明人 SONE YUJI;UEDA NAOYUKI;NAKAMURA YUKI;ABE YUKIKO;MURATA KAZUHIRO;MASUDA KAZUYUKI
分类号 H05B37/02;B05D1/04;B05D3/02;B05D5/00;H05K1/11 主分类号 H05B37/02
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