发明名称 |
METAL LAMINATED SUBSTRATE FOR USE AS AN OXIDE SUPERCONDUCTING WIRE MATERIAL, AND MANUFACTURING METHOD THEREFOR |
摘要 |
A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating. |
申请公布号 |
US2012208703(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201013383957 |
申请日期 |
2010.07.08 |
申请人 |
SUMITOMO ELECTRIC INDUSTRIES, LTD.;TOYO KOHAN CO., LTD. |
发明人 |
OKAYAMA HIRONAO;KUROKAWA TEPPEI;NANBU KOUJI;ISOBE YOSHIHIKO;KOSHIRO TAKASHI;KANEKO AKIRA;OTA HAJIME;OHKI KOTARO;YAMAGUCHI TAKASHI;OHMASTU KAZUYA |
分类号 |
H01L39/02;H01L39/24 |
主分类号 |
H01L39/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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