发明名称 METAL LAMINATED SUBSTRATE FOR USE AS AN OXIDE SUPERCONDUCTING WIRE MATERIAL, AND MANUFACTURING METHOD THEREFOR
摘要 A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.
申请公布号 US2012208703(A1) 申请公布日期 2012.08.16
申请号 US201013383957 申请日期 2010.07.08
申请人 SUMITOMO ELECTRIC INDUSTRIES, LTD.;TOYO KOHAN CO., LTD. 发明人 OKAYAMA HIRONAO;KUROKAWA TEPPEI;NANBU KOUJI;ISOBE YOSHIHIKO;KOSHIRO TAKASHI;KANEKO AKIRA;OTA HAJIME;OHKI KOTARO;YAMAGUCHI TAKASHI;OHMASTU KAZUYA
分类号 H01L39/02;H01L39/24 主分类号 H01L39/02
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