| 摘要 |
<P>PROBLEM TO BE SOLVED: To decrease the size of a heatsink, reduce a cost and fan capability by effectively arranging power semiconductor element modules used for a power conversion circuit on the heatsink. <P>SOLUTION: Power semiconductor element modules M applied to a power conversion circuit for AC output or input in three-phase are arranged at the heatsink in such manner as they are arrayed in two rows relative to the flow direction of air (see an arrow) for cooling the heatsink. Here, U-phase and W-phase are configured in parallel by odd number units (five units, here) while V-phase is configured in parallel by even number of units (six units, here), related to the respective U-phase, V-phase, and W-phase. Consequently, a gap above the heatsink is decreased, for efficient arrangement of the respective modules M. <P>COPYRIGHT: (C)2012,JPO&INPIT |
