| 摘要 |
<P>PROBLEM TO BE SOLVED: To achieve excellent connection between control boards and low-inductance connection between a smoothing capacitor and semiconductor modules, in a power conversion device in which the semiconductor modules are disposed on both sides of a cooler for downsizing. <P>SOLUTION: Semiconductor modules 2 are disposed on both sides of a cooler 1, and control boards 3 for controlling the semiconductor modules 2 are disposed so as to face each of the semiconductor modules 2. The semiconductor modules 2 and the cooler 1 are held by the control boards 3. A current detector 30 or a terminal block 4 is disposed at a location perpendicular to the surface on which the cooler 1 and the semiconductor modules 2 are contacted, and facing the cooler 1. The control boards 3 disposed on both the sides of the cooler 1 are electrically connected to each other by using wiring provided on the current detector 30 or the terminal block 4. <P>COPYRIGHT: (C)2012,JPO&INPIT |
