| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin sealing apparatus having good yield and high productivity, and a method for sealing resin. <P>SOLUTION: The resin sealing apparatus is configured that a resin sealing material is fed into a recess part 67 provided in a lower mold, a substrate on which electronic parts are mounted is positioned on the lower mold, the electronic parts are immersed in the resin sealing material, the substrate is held and clamped by the lower mold and an upper mold, then the resin sealing material is pressed by a pressure control pin arranged on a resin pool part 69 communicating with the recess part 67 to perform resin sealing. Specifically the resin sealing apparatus is arranged outside of the recess part 67 and the resin pool part 69 and is communicated with the recess part 67, and a pressure sensor 72 is arranged in a final region where the pressure of the pressure control pin finally arrives. <P>COPYRIGHT: (C)2012,JPO&INPIT |
