| 摘要 |
<P>PROBLEM TO BE SOLVED: To keep the distance between individual semiconductor chips transferred on tape constant. <P>SOLUTION: Semiconductor chips 1 divided in a semiconductor wafer cutting step, while being pasted to a dicing tape 315, are placed on a top face of a ring stage 335 of a tape drawing device (Fig. 7(a)). Next, a push-up stage 337 is moved in the direction of an arrow to push the dicing tape 315 up (Fig. 7(b)). The dicing tape 315 is thereby extended, causing a distance W to occur between the semiconductor chips 1. Then a transfer tape 341 having adhesive (glue) applied on one side thereof has its glue-applied face contacted with the semiconductor chips 1, whereby the reverse side of the semiconductor chips 1 and the transfer tape 341 are bonded together (Fig. 7(c)). Thereafter, the transfer tape 341 is peeled off, at which time the semiconductor chips 1 are transferred to the transfer tape 341 (Fig. 7(d)). <P>COPYRIGHT: (C)2012,JPO&INPIT |
