发明名称 THERMOSETTING RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE AND PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a thermosetting resin composition which has a black external appearance, does not cause the lowering of the glass transition point (Tg) as a printed wiring board and does not decrease electrical insulating properties and reliability, and is suitable in producing a laminate enabling the examination of external appearance by the system of detecting fluorescence, a prepreg, a metal-clad laminate and a printed wiring board. <P>SOLUTION: The black thermosetting resin composition including a dye comprises 0.05-5 mass% of an anthraquinone-based compound as the dye, and the prepreg, the metal-clad laminate and the printed wiring board are disclosed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012153898(A) 申请公布日期 2012.08.16
申请号 JP20120083808 申请日期 2012.04.02
申请人 HITACHI CHEMICAL CO LTD 发明人 MIYATAKE MASATO;MURAI AKIRA;UCHIMURA RYOICHI
分类号 C08L87/00;B32B5/28;B32B15/08;C08J5/24;C08K5/08;H05K1/03 主分类号 C08L87/00
代理机构 代理人
主权项
地址