| 摘要 |
There are preliminarily prepared element characteristic information 12 that is obtained by individually, previously measuring emission characteristics of a plurality of LED elements and resin coating information 14 that makes a coating quantity of resin appropriate for obtaining an LED package exhibiting a specified emission characteristic correlated with the element characteristic information. A map preparation processing section 74 prepares, for each substrate, map data 18 that correlate populating position information 71 a showing a position of an LED element populated on the substrate by a component populating machine Ml with the element characteristic information 12. According to the map data 18 and the resin coating information 14, a resin coating machine M4 coats the respective LED elements populated on the substrate with an appropriate coating quantity of resin. |
