| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laminate forming method that can polish and grind the surface of a material which has high hardness such as diamond, sapphire, a hard carbon film or the like quickly, easily and at high flatness and accuracy without using diamond grinding particles, alkali slurry or the like by utilizing high adhesion, hardness and surface flatness to a base material, which the carbon film has. <P>SOLUTION: The method includes: a step of preparing the base material; a step of crushing the diamond fine particles and arranging the diamond fine particles on the base material; and a step of introducing a reaction gas into a microwave plasma CVD reaction furnace in which a supply source of an SiO<SB POS="POST">2</SB>material or an AI<SB POS="POST">2</SB>O<SB POS="POST">3</SB>material and the base material obtained at the former process are placed, generating surface-wave plasma, and accumulating a film composed of the SiO<SB POS="POST">2</SB>material or the AI<SB POS="POST">2</SB>O<SB POS="POST">3</SB>material on the base material so that the amount of the SiO<SB POS="POST">2</SB>material or the AI<SB POS="POST">2</SB>O<SB POS="POST">3</SB>material is reduced toward an upper layer from a lower layer at the side of the base material. <P>COPYRIGHT: (C)2012,JPO&INPIT |
