| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a deformation amount predicting device that accurately predicts the final shape of a resin molded product demolded without being completely cooled in a mold, and to provide a deformation amount predicting method, a program, and a recording medium. <P>SOLUTION: A resin flow analysis part 6 calculates residual stress and a temperature distribution with respect to each mesh shape of a model for calculation of the resin molded product molded by injection in the mold based on a molding condition obtained by a molding condition obtaining part 3. A stress analysis part 11 analyzes stress based on the residual stress and temperature distribution, and a temperature-dependent Young's modulus, and calculates the amount of deformation of the resin molded product in mold opening. A thermal stress analysis part 16 calculates the final amount of deformation when the resin molded product is cooled to a predetermined temperature based on the temperature distribution converted by a heat transfer analysis part 13, and a linear expansion coefficient at a temperature lower than or equal to a glass transition temperature Tg and a linear expansion coefficient at a temperature higher than or equal to the glass transition temperature Tg converted from the linear expansion coefficient. <P>COPYRIGHT: (C)2012,JPO&INPIT |
