| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic device capable of improving processing accuracy, simplifying processing steps, and reducing product costs. <P>SOLUTION: The electronic device includes a molded part 11 provided with bosses 15 and 16, and a substrate 12 provided with fixing holes 17 and 18. The molded part 11 is fixed to the substrate 12 by mounting the molded part 11 on one surface of the substrate 12, and by caulking the bosses 15 and 16 inserted into the fixing holes 17 and 18. The substrate 12 is a structure in which a first substrate part 13 and a second substrata part 14 are stacked one upon the other. The fixing holes 17 and 18 are respectively made up of first hole parts 17a and 18a formed in the first substrate part 13 and second hole parts 17b and 18b formed in the second substrate part 14. Diameters D1 and D3 of the first hole parts 17a and 18a are respectively set to be smaller than diameters D2 and D4 of the second hole parts 17b and 18b. When the first substrate part 13 and the second substrate part 14 are stacked one upon the other, the individual hole parts 17a, 18a, 17b and 18b are configured to be concentric to one another. <P>COPYRIGHT: (C)2012,JPO&INPIT |
