发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE |
摘要 |
A semiconductor device including a component substrate of a semiconductor device; electrode pads provided on one surface of the component substrate; a support plate material reinforcing the component substrate; via holes made in the support plate material; a conducting material filled in the via holes; and a joining member interposed between the electrode pads and the conducting material and joining the component substrate and the support plate material.
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申请公布号 |
US2012205817(A1) |
申请公布日期 |
2012.08.16 |
申请号 |
US201213454139 |
申请日期 |
2012.04.24 |
申请人 |
SONY CORPORATION |
发明人 |
ASAMI HIROSHI;HATANO MASAKI;MORIMOTO AKIHIRO |
分类号 |
H01L23/498 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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