发明名称 METAL COATING MATERIAL
摘要 <p>Provided is a metal coating material which is capable of minimizing heat generation accompanying the oxidation during when a seed is coated, while having excellent workability during when heat is dissipated and exhibiting excellent adhesion strength with respect to the seed. A metal coating material (10) which coats a seed (20) by having a metal powder (11), which is mainly composed of iron and contains at least granular fine particles (11A) and plate-like fine particles (11B), adhere to the seed (20). The ratio of the particles having a size of 63-150 µm in the particle size distribution of the metal powder (11) as determined using a JIS test sieve is 23% by weight or more.</p>
申请公布号 WO2012108512(A1) 申请公布日期 2012.08.16
申请号 WO2012JP53001 申请日期 2012.02.09
申请人 DOWA ELECTRONICS MATERIALS CO., LTD.;DOWA IP CREATION CO., LTD.;KUBOTA CORPORATION;TAKEDA HIROKI;SENOO KAZUHIRO;NAKAO KOYA;MAKIHARA KUNIMITSU;YOSHIKAWA KIYONOBU;YAMANE TAKESHI;TSUJINO YUTAKA 发明人 TAKEDA HIROKI;SENOO KAZUHIRO;NAKAO KOYA;MAKIHARA KUNIMITSU;YOSHIKAWA KIYONOBU;YAMANE TAKESHI;TSUJINO YUTAKA
分类号 A01C1/06 主分类号 A01C1/06
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