COMPOSITE BODY, MANUFACTURING METHOD OF THE SAME, AND MANUFACTURING METHOD OF A MULTILAYER BUILDUP WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a composite body enabling easily obtaining a multilayer buildup wiring board.

SOLUTION: A composite body 1 includes: a silicon wafer 2; an insulation resin layer 3 laminated on one surface 2a of the silicon wafer 2; a metallic layer 4 formed of a metal and laminated on a surface 3a of the insulation resin layer 3 opposite to the silicon wafer 2 side; an oxide layer 5 having the oxidized metal of the metallic layer 4 and laminated on a surface 4a of the metallic layer 4 opposite to the insulation resin layer 3 side; and a copper layer 6 laminated on a surface 5a of the oxide layer 5 opposite to the metallic layer 4 side. The metal is nickel or a metal having smaller oxidation-reduction potential than copper.

COPYRIGHT: (C)2012,JPO&INPIT