发明名称 MANUFACTURING METHOD OF MULTILAYER ELECTRONIC COMPONENT
摘要 <P>PROBLEM TO BE SOLVED: To provide a manufacturing method which simplifies processes without generating a gap due to a step caused by an increased thickness of an electrode. <P>SOLUTION: A manufacturing method of multilayer electronic components includes: a process where a ceramic sheet 12 is formed on a support sheet 11 and an electrode pattern 13, which is thicker than the ceramic sheet 12, is formed on the ceramic sheet 12; and a process where a laminated body is formed by layering these components and pressing the layered components. In the press process, the laminated body is formed while the support sheet 11 is being pressed with an elastic body 14 and plastically deformed. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012156219(A) 申请公布日期 2012.08.16
申请号 JP20110012604 申请日期 2011.01.25
申请人 PANASONIC CORP 发明人 MATSUSHIMA KENICHI;KAMEYAMA ICHIRO;OKUDA KAZUHIRO;HIRATE KOJI;MURAISHI TOMOMITSU
分类号 H01F41/04;H01F17/00 主分类号 H01F41/04
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