| 摘要 |
A method of manufacturing a card including an electronic module provides a frame or plate having at least one aperture for receiving the electronic module, is characterized in that at least one part of the peripheral area of at least one aperture is deformed to locally reduce the thickness of the frame in the at least one part of the peripheral area, in that the electronic module is brought opposite the corresponding aperture so that at least one zone of the electronic module is superposed on the at least one part of the peripheral area, and in that a connection is established between the at least one part of the peripheral area and the at least one corresponding zone of the electronic module for assembling the electronic module to the frame before a resin is added at least on one side of the electronic module. |
