| 摘要 |
A PROCESS OF REPAIRING A PLASMA ETCHED LOW-K DIELECTRIC MATERIAL HAVING SURFACE-BOUND SILANOL GROUPS INCLUDES EXPOSING AT LEAST ONE SURFACE OF THE DIELECTRIC MATERIAL TO (A) A CATALYST SO AS TO FORM HYDROGEN BONDS BETWEEN THE CATALYST AND THE SURFACE-BOUND SILANOL GROUPS OBTAINING A CATALYTIC INTERMEDIARY THAT REACTS WITH THE SILANE CAPPING AGENT SO AS TO FORM SURFACE-BOUND SILANE COMPOUNDS, OR (B) A SOLUTION COMPRISING A SUPERCRITICAL SOLVENT, A CATALYST, AND A SILANE CAPPING AGENT SO AS TO FORM HYDROGEN BONDS BETWEEN A CATALYST AND THE SURFACE-BOUND SILANOL GROUPS OBTAINING A CATALYTIC INTERMEDIARY THAT REACTS WITH THE SILANE CAPPING AGENT SO AS TO FORM SURFACE-BOUND SILANE COMPOUNDS. HORIZONTAL NETWORKS CAN BE FORMED BETWEEN ADJACENT SURFACE-BOUND SILANE COMPOUNDS. THE DIELECTRIC MATERIAL CAN BE FURTHER TREATED WITH AN ORGANIC ACID SO AS TO CATALYZE A HYDROLYTIC REACTION WITH ALKOXY GROUPS ON THE SURFACE-BOUND SILANE COMPOUNDS FORMING SILANOL GROUPS THAT CAN BE CONDENSED VIA HEAT TO REMOVE WATER AS A BYPRODUCT. |
