| 摘要 |
<p>It is to improve the storage stability of a sealant, to retain the flowability of the sealant when sealing, and to achieve an effective curing rate of the sealant by heating to be applicable as a sealant for delicate semiconductors. It is an epoxy resin composition for sealing a semiconductor, comprising the following component (A) and component (B).
(A) an epoxy resin,
(B) a clathrate complex comprising
(b1) an aromatic carboxylic acid compound, and
(b2) at least one imidazole compound represented by formula (II)
(wherein R 2 represents a hydrogen atom, etc.; R 3 to R 5 represent a hydrogen atom, etc.).</p> |
