发明名称
摘要 The present invention relates to a die bonder, which performs conveyance of a thermo-compression bonding tape and transfer and attaching of a cut strip of the thermo-compression bonding tape strip with a simple structure and prevents wrinkling of the thermo-compression bonding tape during the conveyance thereof. The die bonder includes a guide 33 that guides a bonding tape 41, a tape suction chuck 13, a retention substrate 35, and a cutter 60. The tape suction chuck 13 sucks the thermo-compression bonding tape 41 on the guide 33 at an initial position, and draws the tape onto the retention substrate in the longitudinal direction of the tape. The drawn tape 41 is sucked and fixed onto the retention substrate 35 and is cut off with the cutter 60 to form a thermo-compression bonding tape strip. The tape suction chuck 13 sucks the thermo-compression bonding tape strip 23, transfers the same onto a lead frame to attach the thermo-compression bonding tape strip to the lead frame. After the tape is attached, the tape suction chuck 13 returns to the initial position.
申请公布号 JP5002267(B2) 申请公布日期 2012.08.15
申请号 JP20070005397 申请日期 2007.01.15
申请人 发明人
分类号 H01L21/52 主分类号 H01L21/52
代理机构 代理人
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