发明名称 Interface connecting dies in an IC package
摘要 A package comprises a first die and a second die. An interface connects said first die and said die. The package comprises interrupt means comprises means for detecting interrupt information, means for providing a packet in response to said detecting means detecting interrupt information, said packet comprising an address to which data in said packet is to be written, said interface being configured to transport said packet. The storage means is provided to which said data is writable, an interrupt event being determined from data received in a plurality of said packets.
申请公布号 EP2339476(B1) 申请公布日期 2012.08.15
申请号 EP20090178184 申请日期 2009.12.07
申请人 STMICROELECTRONICS (RESEARCH & DEVELOPMENT) LIMITED 发明人 JONES, ANDREW MICHAEL;RYAN, STUART
分类号 G06F13/24;H01L25/065 主分类号 G06F13/24
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