发明名称 Wafer-scale cluster image sensor chip and method with replicated gapless pixel line and signal readout circuit segments
摘要 A multi-pixel row wafer-scale cluster image sensor chip (WCISC) is proposed. Expressed in X-Y-Z coordinates with its pixel rows along X-axis, the WCISC converts areal image frame (IMFM) into areal image frame signal (AIFS). The WCISC includes multiple imaging pixel rows PXRW1, . . . , PXRWM. Each PXRWi has photoelectrical sensing elements spanning pixel row width PRWi and producing a pixel row image signal PRISi. Each PXRWi is offset from PXRW1 by distance XOFSTi and spaced from PXRWi−1 by distance SPi−1,I such that X- and Y-extremities of (PXRW1, . . . , PXRWM) define IMFM. The WCISC is so configured that any image pixel sweeping through IMFM will be sensed by at least one imaging pixel row. In the presence of Y-directional relative motion between WCISC and IMFM and an external electronic imaging controller (EEIC) interfacing with the WCISC, the EEIC can extract all PRISi from WCISC and reconstruct the AIFS.
申请公布号 US8243177(B2) 申请公布日期 2012.08.14
申请号 US20090641597 申请日期 2009.12.18
申请人 WANG WENG-LYANG;LIN SHENGMIN;CMOS SENOR, INC. 发明人 WANG WENG-LYANG;LIN SHENGMIN
分类号 H04N3/14;H01L21/44 主分类号 H04N3/14
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