| 摘要 |
A COF package in exemplary form includes a flexible base film, inner leads each made of metal and having a thickness d1, which are disposed at a peripheral edge of a semiconductor chip-mounted predetermined spot on the base film and protruded into the semiconductor chip-mounted predetermined spot, dummy patterns having a thickness d2 (<(d1+d3), where d3 is the thickness of the electrodes), which are disposed at predetermined positions within the semiconductor chip-mounted predetermined spot, a semiconductor chip, and an encapsulating resin. The semiconductor chip has a plurality of the electrodes each protruded into a main surface thereof and having the thickness d3. The electrodes are bonded to the inner leads respectively. Further, the encapsulating resin is charged between the base film and the semiconductor chip. The shape and/or position of the dummy patterns may mark the function of one or more inner leads.
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