发明名称 Method of manufacturing a semiconductor device
摘要 A semiconductor device includes a thin film transistor. The thin film transistor includes a semiconductor film over a substrate, in which the semiconductor film includes a pair of first regions, a pair of second regions interposed between the pair of first regions, and a channel formation region interposed between the pair of second regions. A concentration of an impurity in the pair of second regions is smaller than a concentration of the impurity in the pair of first regions. The thin film transistor includes an insulating film, in which a portion of the insulating film is provided over the semiconductor film. The thin film transistor includes a conductive film over the portion, and the conductive film includes a taper shape.
申请公布号 US8242508(B2) 申请公布日期 2012.08.14
申请号 US201113226803 申请日期 2011.09.07
申请人 HAMADA TAKASHI;ARAI YASUYUKI;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 HAMADA TAKASHI;ARAI YASUYUKI
分类号 H01L29/04;H01L29/786;G02F1/1362;H01L21/77;H01L21/84;H01L27/01;H01L27/12;H01L29/423;H01L31/036;H01L31/0376 主分类号 H01L29/04
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