发明名称 Bonded housing and fluid ejector
摘要 A method of forming a fluid ejector includes positioning a fluid ejection module such that it is adjacent to a mounting frame, applying heat to a thermohardening glue that is between the fluid ejection module and the mounting frame, and curing the glue to secure the fluid ejection module to the mounting frame. The heat is applied with a heating element at least partially embedded in the glue.
申请公布号 US8240817(B2) 申请公布日期 2012.08.14
申请号 US20090616108 申请日期 2009.11.10
申请人 DEMING STEVE;FUJIFILM CORPORATION 发明人 DEMING STEVE
分类号 B41J2/04 主分类号 B41J2/04
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