发明名称 Method for manufacturing flexible semiconductor device
摘要 A method for making a flexible semiconductor device includes the following steps. A rigid substrate is provided. A flexible substrate is provided, and placed on the rigid substrate. A semiconductor device is directly formed on the flexible substrate using a semiconductor process. After the rigid substrate is removed, the flexible semiconductor device is formed.
申请公布号 US8241972(B2) 申请公布日期 2012.08.14
申请号 US20100781036 申请日期 2010.05.17
申请人 WANG XUE-SHEN;LI QUN-QING;TSINGHUA UNIVERSITY;HON HAI PRECISION INDUSTRY CO., LTD. 发明人 WANG XUE-SHEN;LI QUN-QING
分类号 H01L21/00;H01L21/30;H01L21/46;H01L21/84 主分类号 H01L21/00
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