发明名称 |
Method for manufacturing flexible semiconductor device |
摘要 |
A method for making a flexible semiconductor device includes the following steps. A rigid substrate is provided. A flexible substrate is provided, and placed on the rigid substrate. A semiconductor device is directly formed on the flexible substrate using a semiconductor process. After the rigid substrate is removed, the flexible semiconductor device is formed. |
申请公布号 |
US8241972(B2) |
申请公布日期 |
2012.08.14 |
申请号 |
US20100781036 |
申请日期 |
2010.05.17 |
申请人 |
WANG XUE-SHEN;LI QUN-QING;TSINGHUA UNIVERSITY;HON HAI PRECISION INDUSTRY CO., LTD. |
发明人 |
WANG XUE-SHEN;LI QUN-QING |
分类号 |
H01L21/00;H01L21/30;H01L21/46;H01L21/84 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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