MULTI-CHIP MODULE (MCM) POWER QUAD FLAT NO-LEAD (PQFN) SEMICONDUCTOR PACKAGE UTILIZING A LEADFRAME FOR ELECTRICAL INTERCONNECTIONS

摘要

PURPOSE: A multi-chip module(MCM) power quad flat no-lead(PQFN) semiconductor package using a lead frame for electrical interconnections is provided to improve thermal conductivity by exposing large surface area die pads on the bottom surface of the PQFN package. CONSTITUTION: A lead frame is composed of die pads. A driver integrated circuit is coupled to a first die pad of the lead frame. Vertical conduction power devices(140a-140f) include a first group and a second group. The first group is coupled to a second die pad of the lead frame. The second group is individually coupled to corresponding die pads of the lead frame.