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发明名称
电磁能隙结构及印刷电路板
摘要
本发明揭示能够解决类比电路与数位电路间之混合讯号问题的电磁能隙结构与印刷电路板。根据本发明之实施例,电磁能隙结构可包括第一金属层;第一介电层,堆叠于第一金属层;金属板,堆叠于第一介电层;通孔,连接第一金属层至金属板;第二介电层,堆叠于金属板与第一介电层;以及第二金属层,堆叠于第二介电层。此处,可在金属板上形成孔。相对于其他具有相同尺寸之结构,本发明之电磁能隙结构可更加降低相同频带内之杂讯程度。
申请公布号
TWI370710
申请公布日期
2012.08.11
申请号
TW097100737
申请日期
2008.01.08
申请人
三星电机股份有限公司 南韩
发明人
韩美子;金汉;朴大贤;李在濬
分类号
H05K3/00
主分类号
H05K3/00
代理机构
代理人
蔡坤财 台北市中山区松江路148号11楼;李世章 台北市中山区松江路148号11楼
主权项
地址
南韩
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