| 摘要 |
<p>The invention provides a thermosetting double-sided adhesive film having excellent adhesive property and heat resistant property, which is used for fixing a lead space without electrical interference so as to realize the bonding of stacked barechips. Meanwhile, the exfoliation or the popcorn type bursting of interfaces due to the high steam pressure of water internal content absorbed inside a package during the high-temperature processing process is also avoided. The thermosetting double-sided adhesive film is the adhesive film of an adhesive layer coated on the two sides of a polyimides film arranged between barechips, wherein for each 100 parts by weight of a solution containing 1-10 % by weight carboxyl NBR, the adhesive layer comprises 5-200 parts by weight of epoxy resin, 50-200 parts by weight of a phenolic resin and 2-40 parts by weight selected from the group consisting of amine or, anhydride curing agent in one or more curing agent. Measured by the universal method, the softening point of the phenolic-resin is 60-120 DEG C.</p> |
