| 摘要 |
<p>PURPOSE: A bridge PCB and a stacked die semiconductor device using the same are provided to reduce the thickness of a stack using a bridge PCB for leading a top semiconductor die which is stacked in a low semiconductor die. CONSTITUTION: A groove(113) is formed in a base member(111) to lead a semiconductor die. An inner fin(115) is formed in the side of a groove along the edge of the groove. An outer pin(117) is formed in the side or the upper side of the base member a long the edge of the base member. A connection line(119) connects the inner fin and the outer pin. The inner fin, the outer pin, and the connection line are integrally formed.</p> |
