发明名称 Test socket for LED package
摘要 PURPOSE: A test socket for an LED(Light Emitting Diode) package is provided to perform burn-in and performance tests by an LED package unit, thereby minimizing the defective rate of an LED product. CONSTITUTION: An LED package is placed on one side of a housing. A heat emitting fin emits heat of the heat emitting unit of the LED package. The heat emitting fin is integrated with the housing. A pressurizing device(20) pressurizes the LED package. The pressurizing device fixes the LED package to the housing. A contact(36) connects a power unit of the LED package with a circuit board.
申请公布号 KR101173189(B1) 申请公布日期 2012.08.10
申请号 KR20100079112 申请日期 2010.08.17
申请人 发明人
分类号 G01R31/26;H01L21/66 主分类号 G01R31/26
代理机构 代理人
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