发明名称 |
METHOD FOR MANUFACTURING TWO SUBSTRATES CONNECTED BY AT LEAST ONE MECHANICAL AND ELECTRICALLY CONDUCTIVE CONNECTION AND THE STRUCTURE OBTAINED |
摘要 |
A first substrate (2), equipped with an accommodation region (1) made of a first metallic material, is provided. A second substrate (4) equipped with an insertion region (3) comprising a base surface (6) and at least two pads (7) made of a second metallic material is placed facing the first substrate (2). The pads (7) protrude from the base surface (6). Pressure is applied between the first substrate (2) and the second substrate (4) so as to make the pad (7) penetrate into the accommodation region (1). The first metallic material (5) reacts with the second metallic material so as to form a continuous layer of an intermetallic compound (5), based on the first and second metallic materials, along the interface between the pads (7) and the accommodation region (1). |
申请公布号 |
WO2012104507(A1) |
申请公布日期 |
2012.08.09 |
申请号 |
WO2012FR00042 |
申请日期 |
2012.01.31 |
申请人 |
COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIESALTERNATIVES;SOURIAU, JEAN-CHARLES |
发明人 |
SOURIAU, JEAN-CHARLES |
分类号 |
H01L21/60;H01L21/56;H01L23/485;H01L25/065 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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