| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dicing tape which exhibits excellent pickup stability and can shorten the tact time, and to provide a method of manufacturing a semiconductor chip using the dicing tape. <P>SOLUTION: The dicing tape has an adhesive layer containing a gas generating agent which generates a gas when one side of a substrate is irradiated with light. The substrate has low-adhesion parts, exhibiting lower adhesion to the adhesive layer when compared to around, in dot-shape on the surface in contact with the adhesive layer. When the area x (mm<SP POS="POST">2</SP>) of dots of the low-adhesion parts and the interval y (mm) of dots of the low-adhesion parts are plotted on a double logarithmic chart, x and y fall within a range surrounded by a broken line on Fig. 1. <P>COPYRIGHT: (C)2012,JPO&INPIT |
