| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve the problem occurring in the past technology of a multilayer wiring board on which a light-emitting element is mounted, such that it is highly likely to generate cracks in the multilayer wiring board because a flexural strength becomes smaller when a material of high reflectance is selected as a surface insulation layer. <P>SOLUTION: A multilayer wiring board comprises a laminate in which a plurality of insulation layers are laminated, a plurality of conductive vias provided in the laminate, a mount part formed on one principal surface side of the laminate, on which a light-emitting element is mounted, and a wiring part formed on the other principal surface side of the laminate. A surface insulation layer on the one principal surface side of the laminate and a rear face insulation layer on the other principal surface side of the laminate are the insulation layers of the same material. And at least one among inner layers of the laminate is an inner insulation layer and each of the surface insulation layer and the rear face insulation layer has a larger flexural strength than the inner insulation layer. <P>COPYRIGHT: (C)2012,JPO&INPIT |
