发明名称 FLEXIBLE CIRCUIT BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a flexible circuit board which easily enables the price reduction, the formation of an opening, high density structures of elements and electronic components, and multi-layer conductive patterns, and to provide a manufacturing method of the flexible circuit board. <P>SOLUTION: A flexible circuit board includes: a base film 11 composed of an aluminum sheet 111 and a first protection film 112 formed on a surface of the aluminum sheet 111 and in which a sprocket hole 113 and a device hole 114 are formed; a predetermined conductor pattern 12 formed on a surface of the base film; and a second protection film 13, which is composed of aluminum and a film formed on an aluminum surface and having electric insulation properties and is formed so as to cover the predetermined conductor pattern 12. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012151192(A) 申请公布日期 2012.08.09
申请号 JP20110007362 申请日期 2011.01.17
申请人 CANON COMPONENTS INC 发明人 UEHARA KOJI;NAKAI KATSUHIDE;SHIRATO HIROKI
分类号 H01L21/60 主分类号 H01L21/60
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